Remove flux residue, dust and ionic contamination without introducing lint or static damage.
Produce contamination-free PCBs ready for inspection, conformal coating, or final assembly.
Micro-shorts, latent ESD damage, and conformal coating delamination caused by improper wiping materials or techniques.
Prevents micro shorts and dendrite growth.
Protects sensitive ICs during the physical wipe.
Will not dissolve or leach binders when soaked in IPA or flux removers.
We engineer wipes to fit your exact standard operating procedure.
No. Reusing wipes for PCB cleaning risks dragging ionic contamination back across the board.
Compressed air pushes dust into crevices and can generate static charges. Wiping physically removes the contamination.